Thick Film Processes
Hybrid Circuit Works has over 100 years combined 
experience in Thick Film materials, process and design. Working with three flexible, fully automatic print, dry and fire lines, our manufacturing and design services are compatible with any customer schematic. Our highly qualified staff collaborates with clients from design through final qualification and certification, maintaining a focus on providing high quality, solution-oriented products.
Materials
- 96% Alumina substrate
- Silicon wafers
- Aluminium Nitrite
- Indium Tin Oxide (ITO) film
- Beryillium Oxide (BeO)
- FR4
Capabilities
- Custom: Down to 1-2 Mil lines
- Standard: Down to 8 Mil lines
- Double sided multi-layer with through-hole and plugged hole printing
- Up to and over 50 layers
- Active and passive laser trim
- Wire bondable gold
- Solderable conductors
- TF resistors, thermistors, capacitors and inductors
- Coils and RF antenna
- Castellations