Printed Circuit Assembly
The dedicated and experienced team at Hybrid Circuit Works specializes in circuit design, CAD layout, manufacturing and testing of innovative electronic assemblies from prototyping throught high volume production. All circuit assembly manufacturing is compliant with IPC-A-610E Class II or Class III. Put our experience and knowledge to work for you with specialty circuit assembly. 
Substrate Materials
- Single and double-sided FR4
- Flex Circuits
Exotic Materials
- Polyamide
- Teflon
- FR402
- FR406
- Rogers
- Duroid
- BT
- GETEK
- Ceramics
- RF35
- Silicon wafers
Capabilities
Single and double-sided surface mount
- Mixed technology SMT, through-hole and press-fit
- Ball grid array (BGA) to 0.5 mm pitch
- Chip scale packages (CSP)
- 0201 passives
- Large Scale BGA's
- Dual Row QFN .5mm
- Area Grid Array
- DFM analysis
- X-ray
- SnPb and lead free surface mount and wave solder
- Depanelization
- Secondary assembly
- Quick-turn prototypes
- Turn-key material procurement and consigned materials
- Box-build
- Highly accurate saw sepration of smaller PCB's up to 4.125" Square