Hybrid Assembly Technology
Hybrid Circuit Works specializes in design and fabrication of high-density hybrid substrates. Services are compliant to
IPC-HM-860 performance specification for multi-layer hybrids and MIL-PRF-38534 general specification for hybrid microcircuits. Our flexible, fully automatic print, dry and fire lines enable us to meet any client specification with ease.
Materials
- 96% Alumina Substrates
- 99% Alumina Substrates
- Silicon wafers
- Printed Circuit
- Thin Film
Capabilities
- Die attach
- Gold ball wire bonding
- Direct attach flip-chip
- Glob top or cavity fill encapsulation
- Double sided SMT assembly
- Lead attach SIP, DIP, SOJ
- Soft beam soldering
- Wafer saw
- Active laser trim
- Seam sealed, welded or soldered ceramic packages
- Laser marking